Apple may use TSMC’s 3nm process for its M2 Pro and M2 Max chipsets, claims report – Times of India

Apple may reportedly become the first company to use TSMC’s 3nm manufacturing process for its M2 Pro and M2 Max chipsets. According to a report by Commercial Times, both M2 Pro and M2 Max chipsets may be used in this year’s MacBook lineup,
As per the report, the Cupertino-based tech giant will likely first use the 3nm wafers in the second half of 2022 for its M2 Pro chipsets. Then the tech behemoth could also explore using the process to build A17 chipset for 2023 iPhones and in the third-generation of M series. The 3nm process is believed to enhance the performance and the power efficiency of the chipset.

As per earlier reports, Apple could use the M2 Pro and perhaps even the M2 Max chipset in its 14-inch MacBook Pro, 16-inch MacBook Pro, and Mac mini models later this year or in early 2023. From what has been claimed in the reports till now, it looks highly likely that Apple will use the 3nm wafers for the M2 Pro chipsets at least.
A previous report by the Commercial Times had said that TSMC may begin mass producing the 3nm wafers in September 2022 and that based on how the trial production of the N3 process for 3nm wafers went, TSMC could end up giving better initial yield when compared to that obtained during the initial stage of the 5nm N5 process.
The report also claims that TSMC already has plans for the 3nm N3E (the 3nm enhanced version) which will be an improvement over its predecessor. The report went on to add that the N3E process will enter mass production in the second half of 2023, with Apple and Intel becoming the two major customers.